High-safety Chip Grinding and Crushing Machine, Electronic Waste Destruction Treatment and Recycling Machine, with Casters
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- Issue Time
- May 11,2026
Summary
The SPD300 chip grinding machine is suitable for 6-12 inch wafers, with a precision of ±2μm and Ra≤0.01μm. It is highly efficient for mass production and meets safety standards, making it suitable for both production and R&D scenarios.
The SPD300 chip grinding machine is a high-end precision processing equipment tailored for the semiconductor industry. It focuses on the precise thinning and polishing processes of chips and wafers, accurately adapting to 6-12-inch conventional wafers and various special precision chip substrates. It fully meets the ultra-high precision process requirements of core fields such as integrated circuit manufacturing, advanced packaging, and optoelectronic chips. It is an indispensable core equipment in the precision processing link at the back end of the semiconductor industry chain. This equipment is equipped with high-precision CNC spindles and a fully closed-loop intelligent control system. The grinding thickness control accuracy is as high as ±2μm. It supports processing of standard specifications such as 1*1mm² and 2*2mm², and can also be customized to specific sizes according to customer requirements. After processing, the surface roughness Ra of the workpiece is ≤0.01μm, which can achieve undamaged and uniform grinding of the chip throughout the entire area, significantly reducing defects such as warping and edge chipping of the workpiece, and effectively improving the qualification rate of finished chip products. The equipment is equipped with an intelligent variable frequency speed regulation system, allowing for precise and refined control of the grinding rate. It has a processing capacity of over 20 kilograms per hour, efficiently balancing processing accuracy and production efficiency. It features outstanding process stability and supports large-scale continuous operations. At the same time, it is suitable for both industrial large-scale production lines and laboratory precision research and development scenarios. The body adopts a high-rigidity integrated casting structure, ensuring smooth and shock-resistant operation. It is equipped with a high-definition and user-friendly touch operation interface, making the setting of process parameters intuitive and simple, and daily operation and maintenance effortless and efficient. The equipment is equipped with multiple safety protection mechanisms such as overload protection and real-time abnormal alarm. Its safety performance fully complies with the safety grade requirements of O6-O7 and E5-E7 in the DIN66399 standard, providing all-round protection for operation safety. With top-notch precision processing performance, stable and reliable operation output, and strong scene adaptability, the SPD300 chip grinding machine can effectively help semiconductor enterprises break through the technical bottlenecks of precision processing, optimize core production processes, comprehensively improve the quality of chip processing and overall production capacity, and promote the precision upgrade of the industry.